TSM7104D Datasheet | Taiwan Semiconductor

Features — .. — — — — Advanced trench process technology High density cell design for ultra low on-resistance Excellent thermal and electrical capabilities Surface mount Fast switching Block Diagram Ordering Information Part No. TSM7104DCS Packing Tape & Reel Package SOP-8 Absolute Maximum Rating (Ta = 25 o C unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS @4.5V. Pulsed Drain Current, VGS @4.5V Maximum Power Dissipation Ta = 25 C Ta > 25 C Operating Junction Temperature Operating Junction and Storage Temperature Range TJ TJ, TSTG o o Symbol VDS VGS ID IDM PD Limit - 20V ±8 - 2.3 - 10 2 16 +150 - 55 to +150 Unit V V A A W m W/ C o o o Thermal Performance Parameter Junction to Ambient Thermal Resistance (PCB mounted) Note: Surface mounted on FR4 board t<=5sec. Symbol Rθja Limit Unit o C/W 1-3 2003/12 rev. A Electrical Characteristics Rate ID = - 2.3A, (Ta = 25 C unless otherwise noted) o Parameter Static Drain-Source Breakdown Voltage Drain-Source On-State Resistance Drain-Source On-State .. Conditions Symbol Min Typ Max...