Description
Multiple manufacture source
Green compound
Define manufacture source
Green compound
PACKAGE OUTLINE DIMENSION
DIM.A B C D
Unit (mm)
Min Max 0.34 0.60 2.90 5.08 25.40 38.10 1.30 2.28
Unit (inch)
Min Max 0.013 0.024 0.114 0.200 1.000 1.500 0.051 0.090
MARKING DIAGRAM
"x" is Device Code from "2" thru "3".Document Number: DS_S1412008
Version: C14
Small Signal Product
BAT42 / BAT43
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without
Features
- - Low forward voltage drop - Through-hole device type mounting - Hermetically sealed glasss - Compression bonded construction - Solder hot dip tin (Sn) lead finish - All external surfaces are corrosion resistant and
leads are readily solderable
DO-35 Hermetically Sealed Glass.