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MICROWAVE POWER GaN HEMT
TGI1314-50LA
FEATURES
・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER
Pout= 47.0dBm at Pin= 42.0dBm
・HIGH GAIN
GL= 8.0dB at 13.75GHz to 14.5GHz
・LOW INTERMODULATION DISTORTION
IM3(Min.)= -25dBc at Pout= 40.0dBm (Single Carrier Level)
・HERMETICALLY SEALED PACKAGE
RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C )
CHARACTERISTICS
SYMBOL
CONDITIONS
Output Power Drain Current Power Added Efficiency
Pout IDS1 PAE
VDS= 24V IDSset= 2.0A f = 13.75 to 14.5GHz @Pin= 42dBm
Linear Gain Gain Flatness
GL
@Pin= 20dBm
G
3rd Order Intermodulation Distortion
Drain Current Channel Temperature Rise
IM3 IM3-2 IDS2 Tch
Two-tone Test Po= 40.0dBm (Single Carrier Level) f= 5MHz (IM3) f= 150MHz (IM3-2)
(VDS X IDS + Pin – Pout) X Rth(c-c)
Recommended Gate Resistance(Rg): 13.