IRF840S Overview
Key Specifications
Package: D2PAK
Mount Type: Surface Mount
Pins: 3
Height: 4.83 mm
Description
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.
Key Features
- Surface mount
- Available in tape and reel
- Dynamic dV/dt rating
- Repetitive avalanche rated Available
- Fast switching
- Ease of paralleling
- Simple drive requirement Available
