Toshiba |
THGBMBG5D1KBAIL |
4GB density e-MMC |
|
KIOXIA
KIOXIA |
THGBMJG6C1LBAIL |
8GB density of e-MMC Module |
Intel Corporation |
8272 |
Single / Double Density Floppy Disk Controller |
NEC |
UPD765 |
SINGLE/DOUBLE DENSITY FLOPPY DISK CONTROLLER |
Kexin Semiconductor |
PC817 |
High Density Mounting Photocoupler |
AMD |
AM7200 |
High Density First-In First-Out (FIFO) 256 x 9-Bit CMOS Memory |
HOLTIC |
HI-3220 |
High Density 16Rx / 8Tx or 8Rx / 4Tx ARINC 429 Protocol IC |
Renesas |
72V3690 |
HIGH-DENSITY 36-BIT FIFO |
|
Intel Corporation |
8272A |
Single / Double Density Floppy Disk Controller |
|
Toshiba |
THGBMHG7C1LBAIL |
16GB density of e-MMC Module |
Texas Instruments |
TPS631000 |
High Power Density Buck-Boost Converter |
Lattice Semiconductor |
ISPLSI2064A |
In-System Programmable High Density PLD |
Vishay |
S4PM |
High Current Density Surface Mount |
Sharp Corporation |
PC818 |
High Density Mounting Type Photocoupler |
|
Vishay |
B240A |
High Current Density Surface Mount Schottky Rectifier |
Hitachi Semiconductor |
HB56A440BR |
(HB56A840BR / HB56A440BR) 40-Bit High Density DRAM Module |
Vishay |
SMA5Jxx |
(SMA5J5 - SMA5J40CA) High Power Density Surface Mount |
|
Lattice Semiconductor |
LC4384B-5F256I |
Super Fast High Density PLDs |
Integrated Device Technology |
IDT72V16160 |
MULTIMEDIA FIFO 16 BIT V-III/ 32 BIT Vx-III FAMILY UP TO 1 Mb DENSITY |
|
Renesas |
IDT72V36110 |
3.3 VOLT HIGH-DENSITY SUPERSYNC FIFO |
Lite-On Technology |
LTV-827 |
High Density Mounting Type Photocoupler |
|
Lattice Semiconductor |
LC4064V |
/ / In-System Programmable SuperFAST High Density PLDs |
Altera |
EPM5016 |
(EPM5016 - EPM5192) High Speed High Density MAX 5000 Devices |
|
TAISOX
TAISOX |
3470 |
Linear Low Density Polyethylene |
|
Renesas |
72V3680 |
HIGH-DENSITY 36-BIT FIFO |
