.
ABB
5SMX12N4507 - IGBT-Die
VCE IC = = 4500 V 40 A IGBT-Die 5SMX 12N4507 Die size: 14.3 x 14.3 mm Doc. No. 5SYA1626-03 July 06 • • • • Low loss, rugged SPT technology Smoo.
Microsemi Corporation
MSAGA11F120D - Fast IGBT Die
www.DataSheet4U.com 2830 S. Fairview Street Santa Ana, CA 92704 Phone: (714) 979-8220 Fax: (714) 559-5989 MSAGA11F120D Fast IGBT Die for Implantable.
ABB
5SMX12H1273 - IGBT-Die
VCE IC = = 1200 V 50 A IGBT-Die 5SMX 12H1273 Die size: 9.1 x 9.0 mm Doc. No. 5SYA 1641-00 Apr 07 • • • • • Low loss, rugged SPT technology Smoo.
ABB
5SMX12K1273 - IGBT-Die
VCE IC = = 1200 V 75 A IGBT-Die 5SMX 12K1273 Die size: 11.0 x 11.0 mm Doc. No. 5SYA 1633-00 June 05 • • • • • Low loss, rugged SPT technology S.
ABB
5SMX12L2510 - IGBT-Die
VCE IC = = 2500 V 50 A IGBT-Die 5SMX 12L2510 Die size: 12.4 x 12.4 mm Doc. No. 5SYA 1622-03 Sep 05 • • • • Low loss, rugged SPT technology Smoo.
ABB
5SMX12L2511 - IGBT-Die
VCE IC = = 2500 V 54 A IGBT-Die 5SMX 12L2511 Die size: 12.4 x 12.4 mm Doc. No. 5SYA1640-00 Mar 07 • • • • Low loss, rugged SPT technology Smoot.
ABB
5SMX12H1251 - IGBT-Die
9&( ,& 9 $ ,*%7 'LH 60; + 'LH VL]H [ PP Doc. No. 5SYA1607-01 Aug 02 /RZ ORVV WKLQ ,*%7 GLH +LJKO\ UXJJHG 637 GHVLJQ /DUJH I.
International Rectifier
IRG4CC20FB - IGBT Die
IRG4CC20FB IGBT Die in Wafer Form PD- 91831A IRG4CC20FB C G E 600 V Size 2 Fast Speed 6 Wafer Electrical Characteristics ( Wafer Form ) Paramete.
International Rectifier
IRG4CC71KB - IGBT Die
www.DataSheet4U.com PD- 91834A IRG4CC71KB IRG4CC71KB IGBT Die in Wafer Form C 600 V Size 7.1 Ultra-Fast Speed Circuit Rated Rated G E 6 Wafer E.
International Rectifier
IRG4CH40SB - IGBT Die
www.DataSheet4U.com PD-91799A IRG4CH40SB IRG4CH40SB IGBT Die in Wafer Form C G E 1200 V Size 4 Standard Speed 6 Wafer Electrical Characteristics.
International Rectifier
IRG4CC50WB - IGBT Die
PD- 91836A IRG4CC50WB IRG4CC50WB IGBT Die in Wafer Form C 600 V Size 5 WARP Speed G E 6 Wafer Electrical Characteristics ( Wafer Form ) Parameter.
ABB
5SMX12E1273 - IGBT-Die
VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1273 Die size: 6.6 x 6.5 mm Doc. No. 5SYA 1632-00 June 05 • • • • • Low loss, rugged SPT technology Smo.
ABB
5SMX12K1701 - IGBT-Die
9&( ,& 9 $ ,*%7 'LH 60; . 'LH VL]H [ PP Doc. No. 5SYA1619-01 July 03 • /RZ ORVV WKLQ ,*%7 GLH • +LJKO\ UXJJHG 637 GHVLJQ.
ABB
5SMX12L1273 - IGBT-Die
VCE IC = = 1200 V 100 A IGBT-Die 5SMX 12L1273 Die size: 12.6 x 12.6 mm Doc. No. 5SYA 1634-00 June 05 • • • • • Low loss, rugged SPT technology .
ABB
5SMX12M1273 - IGBT-Die
VCE IC = = 1200 V 150 A IGBT-Die 5SMX 12M1273 Die size: 13.6 x 13.6 mm Doc. No. 5SYA1637-00 July 06 • Low loss thin IGBT die • Highly rugged SPT.
ABB
5SMX12M1701 - IGBT-Die
9&( ,& 9 $ ,*%7 'LH 60; 0 'LH VL]H [ PP Doc. No. 5SYA1620-01 July 03 • • • • /RZ ORVV WKLQ ,*%7 GLH +LJKO\ UXJJHG 637 .
ABB
5SMX12M3300 - IGBT-Die
VCE IC = = 3300 V 50 A IGBT-Die 5SMX 12M3300 Die size: 13.6 x 13.6 mm Doc. No. 5SYA1621-02 Sep 05 • • • • Low loss, rugged SPT technology Smoot.
ABB
5SMX12M6500 - IGBT-Die
VCE IC = = 6500 V 25 A IGBT-Die 5SMX 12M6500 PRELIMINARY Die size: 13.6 x 13.6 mm Doc. No. 5SYA1627-01 Sep 05 • • • • Low loss, rugged SPT techn.
International Rectifier
IRG4CC50UB - IGBT Die
IRG4CC50UB IGBT Die in Wafer Form PD- 91764A IRG4CC50UB C G E 600 V Size 5 Ultra-Fast Speed 6 Wafer Electrical Characteristics ( Wafer Form ) Pa.