gaas solder bump flip chip schottky diode.
* Low Series Resistance, 4 Ω
* Low Capacitance, 45 fF
* High Cutoff Frequency
* Silicon Nitride Passivation
* Polyimide Scratch Protection
* Solde.
The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical Applications include si.
M/A-COM’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be.
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