C527UT170 Datasheet - CREE

C527UT170 LED

P-N Junction Area (μm) Chip Top Area (μm) Chip Thickness (μm) Chip Bottom Area (μm) Au Bond Pad Diameter (μm) Bonding Area Diameter (μm) Note 5 Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT170-Sxxxx-31 Dimension Tolerance 140 x 140 ± 25 170 x 170 ± 25 50 ± 10 130 x 130.

Cree® UltraThin® Gen 3 LEDs Data Sheet CxxxUT170-Sxxxx-31 Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary G SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications, as well as the ability to withstand 2000 V ESD. Applications include consumer products, mo.

C527UT170 Features

* Small Chip

* 170 x 170 x 50 μm

* Single Wire Bond Structure

* UT LED Performance

* 450 nm

* 12+ mW

* 460 nm

* 10+ mW

* 470 nm

* 10+ mW

* 527 nm

* 4+ mW

* Low Forward Voltage

* 2.9 V Ty

C527UT170 Datasheet (263.04 KB)

C527UT170 Datasheet Preview — Preview of C527UT170 PDF

Datasheet Details

Part number:

C527UT170

Manufacturer:

CREE

File Size:

263.04 KB

Description:

Led.

📁 Related Datasheet

C527UT190 LED (CREE)

C5270 2SC5270 (Panasonic Semiconductor)

C5271 2SC5271 (Sanken electric)

C5275 2SC5275 (Sanyo)

C5277 2SC5277 (Sanyo)

C5200 Silicon NPN Transistor (Toshiba)

C5200N NPN Transistor (Toshiba)

C5201 2SC5201 (Toshiba)

TAGS

C527UT170 LED CREE

C527UT170 Distributor