C527UT190 Datasheet - CREE

C527UT190 LED

P-N Junction Area (μm) Chip Top Area (μm) Chip Bottom Area (μm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Bonding Area Note 5 Diameter (μm) Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT190-Sxxxx-31 Dimension Tolerance 160 x 160 ± 25 190 x 190 ± 25 150 x 150 ± 25 50.

Cree® UltraThin® UT190™ Gen 3 LEDs CxxxUT190-Sxxxx-31 Data Sheet (50 µm chip thickness) Cree’s UT190 LEDs combine highly efficient InGaN materials with Cree’s proprietary G SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small and thin with low forward voltage. Cree’s UT™ series chips are 100% tested for conformity to optical and electrical specifications, as well as the ability to withstand a 2000 V ESD pulse. Applicati.

C527UT190 Features

* Wavelengths for Blue, Green and White-conversion

* 50 mm Chip Thickness

* RF Performance:

* 450 nm

* 12+ mW

* 460 nm

* 10+ mW

* 470 nm

* 10+ mW

* 527 nm

* 4+ mW

* Low Forward Voltage

* 2.9

C527UT190 Datasheet (390.26 KB)

C527UT190 Datasheet Preview — Preview of C527UT190 PDF

Datasheet Details

Part number:

C527UT190

Manufacturer:

CREE

File Size:

390.26 KB

Description:

Led.

📁 Related Datasheet

C527UT170 LED (CREE)

C5270 2SC5270 (Panasonic Semiconductor)

C5271 2SC5271 (Sanken electric)

C5275 2SC5275 (Sanyo)

C5277 2SC5277 (Sanyo)

C5200 Silicon NPN Transistor (Toshiba)

C5200N NPN Transistor (Toshiba)

C5201 2SC5201 (Toshiba)

TAGS

C527UT190 LED CREE

C527UT190 Distributor