DIM200MHS17-A000 Datasheet - Dynex Semiconductor

DIM200MHS17-A000 Igbt Modules - Half Bridge

DIM200MHS17-A000 Features

* s s s 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Base Plate KEY PARAMETERS VCES (typ) VCE(sat)

* (max) IC (max) IC(PK) 1700V 2.7V 200A 400A

* (measured at the power busbars and not the auxiliary terminals) APPLICATIONS s s Inverters Motor Controllers 11(C2) 6

Datasheet Details

DIM200MHS17-A000

Dynex Semiconductor

192.41 KB

Igbt modules - half bridge.

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