Datasheet4U Logo Datasheet4U.com

DIM200MHS17-A000 - Igbt Modules - Half Bridge

Datasheet Summary

Features

  • s s s 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Base Plate KEY.

📥 Download Datasheet

Datasheet preview – DIM200MHS17-A000

Datasheet Details

Part number DIM200MHS17-A000
Manufacturer Dynex Semiconductor
File Size 192.41 KB
Description Igbt Modules - Half Bridge
Datasheet download datasheet DIM200MHS17-A000 Datasheet
Additional preview pages of the DIM200MHS17-A000 datasheet.
Other Datasheets by Dynex Semiconductor

Full PDF Text Transcription

Click to expand full text
www.DataSheet4U.com DIM200MHS17-A000 DIM200MHS17-A000 Half Bridge IGBT Module Replaces issue March 2002, version DS5459-4.0 DS5459-5.1 June 2002 FEATURES s s s 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Base Plate KEY PARAMETERS VCES (typ) VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V 200A 400A *(measured at the power busbars and not the auxiliary terminals) APPLICATIONS s s Inverters Motor Controllers 11(C2) 6(G2) 7(E2) 3(C1) The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 2400A. The DIM200MHS17-A000 is a half bridge 1700V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module.
Published: |