* z z z z z z z 50/60 Hz, RMS, t = 1Minute IISOL < 1mA t = 20 Seconds Mounting Force Maximum Lead Temperature for Soldering 1.6mm (0.062 in.) from Case for 10s 2500 3000 20..120/4.5..27 300 260 5 Silicon Chip on Direct-Copper Bond (DCB) Substrate Optimized for Low Switching Losses Square RBSOA Iso
IXGR72N60C3D1 Datasheet (232.59 KB)
IXGR72N60C3D1
IXYS
232.59 KB
Igbt.
GenX3TM 600V IGBT with Diode High-Speed Low-Vsat PT IGBT 40-100 kHz Switching IXGR72N60C3D1 VCES IC110 VCE(sat) tfi(typ) = = ≤£ = 600V 35A 2.7V 55.
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