Part number:
PTFB211501F
Manufacturer:
File Size:
349.42 KB
Description:
Thermally-enhanced high power rf ldmos fets.
PTFB211501F Datasheet (349.42 KB)
* include I/O matching, high gain, and thermally-enhanced ceramic open-cavity packages with slotted and earless flanges. PTFB211501E Package H-36248-2 PTFB211501F Package H-37248-2 ACP (dBc) Drain Efficiency (%) Single-carrier WCDMA Drive Up VDD = 30 V, IDQ = 1.20 A, ƒ = 2170 MHz 3GPP WCDMA, PAR =
PTFB211501F Datasheet (349.42 KB)
PTFB211501F
349.42 KB
Thermally-enhanced high power rf ldmos fets.
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