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IRF6100 HEXFET Power MOSFET

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Description

l Ultra Low RDS(on) per Footprint Area l Low Thermal Resistance l P-Channel MOSFET l One-third Footprint of SOT-23 l Super Low Profile (<.8mm) l Avail.
True chip-scale packaging is available from International Rectifier.

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Datasheet Specifications

Part number
IRF6100
Manufacturer
International Rectifier
File Size
633.36 KB
Datasheet
IRF6100-InternationalRectifier.pdf
Description
HEXFET Power MOSFET

Applications

* These benefits, combined with the ruggedized device design , that International Rectifier is well known for, provides the designer with an extremely efficient and reliable device. G The FlipFETâ„¢ package, is one-third the footprint of a comparable SOT-23 package and has a profile of less than .8mm

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