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BSP16T1 - PNP SILICON HIGH VOLTAGE TRANSISTOR

BSP16T1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BSP16T1/D SOT-223 Package High Voltage Transistor PNP Silicon COLLECTOR 2,4 BASE 1 EMI.

BSP16T1 Features

* JOINT SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 1. Typical Solder Heating Profile 4 Motorola Small
* Signal Transistors, FETs and Diodes Device Data BSP16T1 PACKAGE DIMENSIONS A F NOTES: 1. DIMENSIONING AND TOLERANCING

BSP16T1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.15 3.8 0.079 2.0 interface between the board and the package. With the correct pad geometry, the packages will self align

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Datasheet Details

Part number
BSP16T1
Manufacturer
Motorola Inc
File Size
109.16 KB
Datasheet
BSP16T1_MotorolaInc.pdf
Description
PNP SILICON HIGH VOLTAGE TRANSISTOR

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PNP SILICON HIGH VOLTAGE TRANSISTOR Motorola Inc
Motorola Inc BSP16T1-like datasheet