* ring a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of
MMFT960T1 Datasheet (78.40 KB)
MMFT960T1
ON
78.40 KB
Power mosfet 300 ma / 60 volts.
MMFT960T1
Preferred Device
Power MOSFET 300 mA, 60 Volts
N
*Channel SOT
*223
This Power MOSFET is designed for high speed, low loss pow.
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