Datasheet Details
Part number:
K9F2G08Q0M
Manufacturer:
Samsung semiconductor
File Size:
583.49 KB
Description:
FLASH MEMORY
Features
* and specifications including FAQ, please refer to Samsung’ s Flash web site. http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG El
K9F2G08Q0M_Samsungsemiconductor.pdf
K9F2G08Q0M, FLASH MEMORY
Offered in 16Mx8bit or 8Mx16bit, the K9F28XXX0C is 128M bit with spare 4M bit capacity.
The device is offered in 1.8V or 3.3V Vcc.
Its NAND cell provides the most cost-effective solutIon for the solid state mass storage market.
A program operation can be performed in typical 200µs on the 528-byte(X8
K9F2808Q0C-DCB0,DIB0 K9F2808U0C-YCB0,YIB0 K9F2808U0C-DCB0,DIB0 K9F2816Q0C-DCB0,DIB0 K9F2816U0C-YCB0,YIB0 K9F2816U0C-DCB0,DIB0 K9F2808U0C-VCB0,VIB0 FLASH MEMORY Document Title 16M x 8 Bit , 8M x 16 Bit NAND Flash Memory Revision History Revision No.
History 0.0 1.0 Initial issue.
TBGA PKG Dimension Change 48-Ball, 6.0mm x 8.5mm > 63-Ball, 9.0mm x 11.0mm 1.A3 Pin assignment of TBGA Package is changed.(Page 4) (before) NC > (after) Vss 2.
Add the Rp vs tr ,tf & Rp vs ibusy gr
K9F2G08Q0M Distributor
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