DESCRIPTION
PIN CONFIGURATION SOT-23 3 D G S 1 2 1.Gate 2.Source 3.Drain PART MARKING SOT-23 3 FEATURE 30V/5.8A, RDS(ON) = 25mΩ (Typ.) @VGS = 10V 30V/4.8A, RDS(ON) = 30mΩ @VGS = 4.5V 30V/4.0A, RDS(ON) = 40mΩ @VGS = 2.5V Super high density cell design for extremely low RDS(ON) Exceptional on-resistance and maximum DC current capability SOT-23 package design A0YA 1 2 Y: Year Code A: Week Code 1 120 Bentley Square, Mountain View, Ca 94040 USA STN3400SRG 2009. V1 ST3400SRG N Channel Enhancement Mode MOSFET 5.8A ABSOULTE MAXIMUM RATINGS
(Ta = 25℃ Unless otherwise noted ) Parameter Symbol Typical Drain-Source Voltage VDSS 30 Gate-Source Voltage VGSS ±12 Continuous Drain CurrentTJ=150℃) TA=25℃ TA=70℃ ID 5.8 3.5 Pulsed Drain Current IDM 25 Continuous Source Current (Diode Conduction) IS 1.7 Power Dissipation TA=25℃ TA=70℃ PD 2.0 1.3 Operation Junction Temperature TJ 150 Storgae Temperature Range TSTG -55/150 Thermal Resistance-Junction to Ambient RθJA 90 Unit V V A A A W ℃ ℃ ℃/W 2 120 Bentley Square, Mountain View, Ca 94040 USA STN3400SRG 2009.