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TC2997D Datasheet PDF

Transcom TC2997D

The TC2997D is a packaged Pseudomorphic High Electron Mobility Transistor (PHEMT) power transistor with input prematched circuits. The flange ceramic package provides the best thermal conductivity for the GaAs FET.
Part No. TC2997D
Datasheet TC2997D Download
Manufacturer
Transcom
Description 2.45 GHz 20 W Flange Ceramic Packaged GaAs Power FETs
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TC2997D datasheet page 1 preview

FEATURES

● 20W Typical Power at 2.45 GHz
● 10dB Typical Linear Power Gain at 2.45 GHz
● High Linearity: IP3 = 52 dBm Typical
● High Power Added Efficiency: Nominal PAE of 40 %
● Suitable for High Reliability Application
● Wg = 50 mm
● 100 % DC and RF Tested PHOTO ENLARGEMENT
● Flange Ceramic Package

DESCRIPTION

All devices are 100% DC and RF tested to assure consistent quality. Typical applications include high dynamic range power amplifiers for commercial applications.

ELECTRICAL SPECIFICATIONS

( VDS = 10.5V, IDS = 5A @ 2.45GHz ) Symbol P1dB GL IP3 PAE IDSS gm VP BVDGO Rth Linear Power Gain Intercept Point of the 3rd-order Intermodulation *PSCL = 32 dBm Power Added Efficiency at 1dB Compression Power Saturated Drain-Source Current at VDS = 2 V, VGS = 0 V Transconductance at VDS = 2 V, VGS = 0 V Pinch-off Voltage at VDS = 2 V, ID = 60 mA Drain-Gate Breakdown Voltage at IDGO =15 mA Thermal Resistance 20 CONDITIONS Output Power at 1dB Gain Compression Point MIN 42 9 TYP 43 10 52 40 12.5 9000 -1.7 22 0.9 MAX UNIT dBm dB dBm % A mS Volts Volts °C/W * PSCL: Output Power of Single Carrier Level.
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