TSSOP-8 Datasheet | Specifications & PDF Download

DIMENSIONS REF. A A1 A2 b c www.DataSheet4U.com D E E1 e K L 0° 0.45 0.60 0.05 0.8 0.19 0.09 4.9 6.2 4.3 5 6.4 4.4 0.65 8° 0.75 0° 0.018 0.024 1 mm M

(5 views)

General Description RTM870T-691 is a TSSOP56 low power main clock for ATI RS600 system using AMD K8 processors & SB600 Southbridge Output Features: z

(5 views)

TSSOP and MSOP Small Outline Packages • Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available (TSSOP-ep and MSOP-ep)

(4 views)

Packaging Information Mechanical Dimensions TSSOP-20 6.400(0.252) 6.600(0.260) Unit: mm(inch) 1.450(0.057) 0.000(0.000) Dp 1.550(0.061) 0.100(0.004)

(3 views)

TSSOP-8 Tape and Reel Dimensions Carrier Tape D1 T P1 P2 E1 E2 B0 E K0 Unit: mm Package TSSOP-8 (12mm) A0 6.80 ±0.10 B0 3.40 ±0.10 K0 1.60 ±0.10 D0 1

(3 views)

LSI Assembly TSSOP-B8/B8J (Units : mm) • TSSOP-B8/B8J 3.0 8 5 3.0 8 5 6.4 4.4 4.9 3.0 1 4 1 4 H=1.2Max. H=1.1Max. The contents described here

(3 views)

LSI Assembly TSSOP-C10J • TSSOP-C10J 3.0±0.1 (Max 3.35 include BURR) 10 9 8 7 6 4 +6 -4 4.9±0.2 3.0±0.1 0.45±0.15 0.85±0.05 0.5 1 2 3 4 5 1PIN

(3 views)

Package information - TSSOP20 Surface mounted, 20 pin package Package outline D E1 E L c A2 A b DIM A A1 A2 D E L e b c e A1 Millimeters Min Max

(3 views)

16 Lead TSSOP Package Dimensions TSSOP-16 7.72 TYP 4.16 TYP. (1.78 TYP) 5.0 ± 0.1 -A0.42 TYP 8 16 0.65 TYP LAND PATTERN RECOMMENDATION 6.4 GAGE

(3 views)

DAISY CHAIN TOP VIEW (INTERNAL CONNECTIONS) 48 25 PIN 1 24 DAISY CHAIN NET LIST PINS PINS 11 ~ 12 13 ~ 14 15 ~ 16 17 ~ 18 19 ~ 20 PINS 21 ~ 22

(3 views)

Philips Semiconductors PC board footprint Footprint information for reflow soldering of TSSOP48 package SOT362-1 Hx Gx P2 (0.125) (0.125) Hy Gy

(3 views)

24C02 / 24C04 / 24C08 / 24C16 Features ¡Wide Voltage Operation ¡ C to +85£ ¡C ¡Operating Ambient Temperature: -40£ ¡Internally Organized: - 24C02, 2

(2 views)

LSI Assembly TSSOP-B8/B8J (Units : mm) • TSSOP-B8/B8J 3.0 8 5 3.0 8 5 6.4 4.4 4.9 3.0 1 4 1 4 H=1.2Max. H=1.1Max. The contents described here

(2 views)

LSI Assembly TSSOP-C48V • TSSOP-C48V 12.5±0.1 (MAX 12.85 include BURR) 48 25 4¼ +6¼ -4¼ 8.1±0.2 6.1±0.1 0.5 1.0MAX 1 1PIN MARK 24 S 0.85±0.0

(2 views)

TSSOP-16 Package 16-Pin Ceramic Case 6.4 X 5.0 mm Nominal Footprint Case Dimensions Dimension A B C D E F G L L1 R R1 01 02 03 mm Nom Max 4.40 4.50 5.

(2 views)

DIMENSIONS REF. A A1 A2 b c D E8 E1 e K0 L ° 0.45 6.0 0.5 8° 0.75 0° 0.018 0.17 0.09 12.4 .1 6.2 0.236 0.0197 8° 0.030 0.05 0.9 0.27 0.20 12.6 0.0067

(2 views)

LT6301 Dual 500mA, Differential xDSL Line Driver in 28-Lead TSSOP Package FEATURES s s DESCRIPTIO s s s s s s s s s Drives Two Lines from One Packa

(1 views)

www.DataSheet4U.com LSI Assembly HTSSOP-A44 (Units : mm) • HTSSOP-A44 18.5 44 (6.0) 23 (5.0) 1 1PIN MARK 22 9.5 7.5 0.85 H=1.0Max. The contents

(1 views)

www.DataSheet4U.com LSI Assembly HTSSOP-B20 (Units : mm) • HTSSOP-B20 6.5 20 11 6.4 4.4 0.325 1 10 H=1.0Max. The contents described herein a

(1 views)

www.DataSheet4U.com LSI Assembly HTSSOP-B24 (Units : mm) • HTSSOP-B24 7.8 24 13 7.6 5.6 1 0.325 12 1PIN MARK H=1.0Max. The contents described

(1 views)