TSSOP-8 Datasheet | Specifications & PDF Download

DIMENSIONS REF. A A1 A2 b c www.DataSheet4U.com D E E1 e K L 0° 0.45 0.60 0.05 0.8 0.19 0.09 4.9 6.2 4.3 5 6.4 4.4 0.65 8° 0.75 0° 0.018 0.024 1 mm M

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24C02 / 24C04 / 24C08 / 24C16 Features ¡Wide Voltage Operation ¡ C to +85£ ¡C ¡Operating Ambient Temperature: -40£ ¡Internally Organized: - 24C02, 2

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TSSOP and MSOP Small Outline Packages • Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available (TSSOP-ep and MSOP-ep)

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16 Lead TSSOP Package Dimensions TSSOP-16 7.72 TYP 4.16 TYP. (1.78 TYP) 5.0 ± 0.1 -A0.42 TYP 8 16 0.65 TYP LAND PATTERN RECOMMENDATION 6.4 GAGE

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Packaging Information Mechanical Dimensions TSSOP-20 6.400(0.252) 6.600(0.260) Unit: mm(inch) 1.450(0.057) 0.000(0.000) Dp 1.550(0.061) 0.100(0.004)

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24C02 / 24C04 / 24C08 / 24C16 Features ¡Wide Voltage Operation ¡ C to +85£ ¡C ¡Operating Ambient Temperature: -40£ ¡Internally Organized: - 24C02, 2

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TSSOP-16 Package 16-Pin Ceramic Case 6.4 X 5.0 mm Nominal Footprint Case Dimensions Dimension A B C D E F G L L1 R R1 01 02 03 mm Nom Max 4.40 4.50 5.

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LSI Assembly TSSOP-B8/B8J (Units : mm) • TSSOP-B8/B8J 3.0 8 5 3.0 8 5 6.4 4.4 4.9 3.0 1 4 1 4 H=1.2Max. H=1.1Max. The contents described here

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Package information - TSSOP20 Surface mounted, 20 pin package Package outline D E1 E L c A2 A b DIM A A1 A2 D E L e b c e A1 Millimeters Min Max

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General Description RTM870T-691 is a TSSOP56 low power main clock for ATI RS600 system using AMD K8 processors & SB600 Southbridge Output Features: z

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TSSOP-8 Tape and Reel Dimensions Carrier Tape D1 T P1 P2 E1 E2 B0 E K0 Unit: mm Package TSSOP-8 (12mm) A0 6.80 ±0.10 B0 3.40 ±0.10 K0 1.60 ±0.10 D0 1

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24C02 / 24C04 / 24C08 / 24C16 Features ¡Wide Voltage Operation ¡ C to +85£ ¡C ¡Operating Ambient Temperature: -40£ ¡Internally Organized: - 24C02, 2

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LSI Assembly TSSOP-B8/B8J (Units : mm) • TSSOP-B8/B8J 3.0 8 5 3.0 8 5 6.4 4.4 4.9 3.0 1 4 1 4 H=1.2Max. H=1.1Max. The contents described here

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LT6301 Dual 500mA, Differential xDSL Line Driver in 28-Lead TSSOP Package FEATURES s s DESCRIPTIO s s s s s s s s s Drives Two Lines from One Packa

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www.DataSheet4U.com LSI Assembly HTSSOP-D80 (Units : mm) • HTSSOP-D80 17.0 80 41 8.1 6.1 0.7 1 1PIN MARK 40 H=1.0Max. The contents describe

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Design Support Document IC Packages TSSOP-B14J 5.0±0.1 (Max 5.35 include BURR) 14 8 4º ±4º 6.4±0.2 4.4±0.1 0.55 1.0±0.05 1 7 1PIN MARK S +0.0

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HTSSOP-C48 LSI Assembly www.DataSheet4U.net • HTSSOP-C48 12.5 ± 0.1 (MAX 12.85 include BURR) (5.0) 48 25 4 +6 -4 0.5±0.15 1.0±0.2 0.17 +0.05 -0.03

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HTSSOP-B28 LSI Assembly www.DataSheet4U.net • HTSSOP-B28 9.7 ± 0.1 (MAX 10.05 include BURR) (5.5) 28 15 4 +6 –4 6.4 ± 0.2 4.4 ± 0.1 (2.9) 1 14

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24C02 / 24C04 / 24C08 / 24C16 Features ¡Wide Voltage Operation ¡ C to +85£ ¡C ¡Operating Ambient Temperature: -40£ ¡Internally Organized: - 24C02, 2

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LSI Assembly TSSOP-C10J • TSSOP-C10J 3.0±0.1 (Max 3.35 include BURR) 10 9 8 7 6 4 +6 -4 4.9±0.2 3.0±0.1 0.45±0.15 0.85±0.05 0.5 1 2 3 4 5 1PIN

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