centralsemi Datasheet | Specifications & PDF Download

PROCESS Schottky Rectifier CPD107 3 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalizatio

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PROCESS CPD109R Schottky Diode Low VF Schottky Diode Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back

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PROCESS Small Signal Transistor CP788X PNP - Low Noise Amplifier Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A

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PROCESS Small Signal Transistor CP588V PNP - Low Noise Amplifier Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A

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PROCESS 6.2 Volt TVS Chip CPZ34R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization B

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PROCESS CPQ166 TRIAC 25 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side M

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Product Brief CPD31X CPD34X 10A, 60V Schottky Rectifier Die Die Size Die Thickness Die Passivation Anode Bonding Pad Area Top Side Metalization (CPD31X

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PROCESS Small Signal MOSFET Transistor N-Channel Enhancement-Mode Transistor Chip CP379X PROCESS DETAILS Die Size Die Thickness Gate Bonding Pad Ar

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PROCESS 5 Volt TVS Chip CPZ40X Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization B

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PROCESS 3.3 Volt TVS Chip CPZ35R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization

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PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Meta

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PROCESS 12 Volt TVS Chip CPZ37R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Ba

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PROCESS 5.0 Volt TVS Chip CPZ36R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization

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PROCESS Schottky Rectifier CPD79 2 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization

(18 views)

PROCESS Schottky Rectifier CPD38X 8 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalizatio

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Product Brief CPD31X CPD34X 10A, 60V Schottky Rectifier Die Die Size Die Thickness Die Passivation Anode Bonding Pad Area Top Side Metalization (CPD31X

(18 views)

PROCESS CPD30V Dual Switching Diode Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size Die Thickness Anode 1 Bonding Pa

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PROCESS CPZ33R Transient Voltage Suppressor 12 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Met

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PROCESS CPD76X Schottky Diode 1 Amp Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization

(17 views)

PROCESS Small Signal Transistor CP388X NPN - Low Noise Amplifier Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A

(17 views)