CPD109R (centralsemi)
Low VFSchottky Diode
PROCESS
CPD109R
Schottky Diode
Low VF Schottky Diode Chip
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back
Published:
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8 views
CP588V (centralsemi)
PNP - Low Noise Amplifier Transistor Chip
PROCESS
Small Signal Transistor
CP588V
PNP - Low Noise Amplifier Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A
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8 views
CPD92X (centralsemi)
High Voltage Schottky Diode
PROCESS
CPD92X
Schottky Diode
High Voltage Schottky Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metal
Published:
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7 views
CPD31X (centralsemi)
10A / 60V Schottky Rectifier Die
Product Brief
CPD31X CPD34X
10A, 60V Schottky Rectifier Die
Die Size Die Thickness Die Passivation Anode Bonding Pad Area Top Side Metalization (CPD31X
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7 views
CPQ166 (centralsemi)
TRIAC
PROCESS CPQ166
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side M
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6 views
CPD93V (centralsemi)
High Current Switching Diode
PROCESS
CPD93V
Switching Diode
High Current Switching Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Met
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6 views
CPD38X (centralsemi)
8 Amp Schottky Rectifier
PROCESS
Schottky Rectifier
CPD38X
8 Amp Schottky Rectifier Chip
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalizatio
Published:
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6 views
CPD34X (centralsemi)
10A / 60V Schottky Rectifier Die
Product Brief
CPD31X CPD34X
10A, 60V Schottky Rectifier Die
Die Size Die Thickness Die Passivation Anode Bonding Pad Area Top Side Metalization (CPD31X
Published:
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6 views
CPZ39R (centralsemi)
5 Volt Quad TVS
PROCESS
CPZ39R
Transient Voltage Suppressor
5 Volt Quad TVS Chip
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Meta
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5 views
CPZ34R (centralsemi)
6.2 Volt TVS
PROCESS
6.2 Volt TVS Chip
CPZ34R
Transient Voltage Suppressor
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization B
Published:
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5 views
CP388X (centralsemi)
NPN - Low Noise Amplifier Transistor Chip
PROCESS
Small Signal Transistor
CP388X
NPN - Low Noise Amplifier Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A
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5 views
CP379X (centralsemi)
N-Channel Enhancement-Mode Transistor Chip
PROCESS
Small Signal MOSFET Transistor
N-Channel Enhancement-Mode Transistor Chip
CP379X
PROCESS DETAILS Die Size Die Thickness Gate Bonding Pad Ar
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5 views
CPZ35R (centralsemi)
3.3 Volt TVS
PROCESS
3.3 Volt TVS Chip
CPZ35R
Transient Voltage Suppressor
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization
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4 views
CPZ33R (centralsemi)
12 Volt Quad TVS
PROCESS
CPZ33R
Transient Voltage Suppressor
12 Volt Quad TVS Chip
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Met
Published:
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4 views
CPZ28 (centralsemi)
0.5 Watt Zener Diode
PROCESS
Zener Diode
CPZ28
0.5 Watt Zener Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Bac
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4 views
CPD89V (centralsemi)
High Current Diode
PROCESS
CPD89V
Switching Diode
High Current Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization
Published:
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4 views
CPD79 (centralsemi)
2 Amp Schottky Rectifier
PROCESS
Schottky Rectifier
CPD79
2 Amp Schottky Rectifier Chip
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization
Published:
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4 views
CPD69 (centralsemi)
1 Amp Glass Passivated Rectifier
PROCESS
General Purpose Rectifier
1 Amp Glass Passivated Rectifier Chip
CPD69
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area
Published:
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4 views
CPD30V (centralsemi)
High Speed Switching Diode
PROCESS
CPD30V
Dual Switching Diode
Dual, Common Cathode, High Speed Switching Diode Chip
PROCESS DETAILS Die Size Die Thickness Anode 1 Bonding Pa
Published:
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4 views
CP788X (centralsemi)
PNP - Low Noise Amplifier Transistor
PROCESS
Small Signal Transistor
CP788X
PNP - Low Noise Amplifier Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A
Published:
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4 views
