.
centralsemi
CPZ37R - 12 Volt TVS
PROCESS 12 Volt TVS Chip CPZ37R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Ba.
centralsemi
CPD79 - 2 Amp Schottky Rectifier
PROCESS Schottky Rectifier CPD79 2 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization.
centralsemi
CPD38X - 8 Amp Schottky Rectifier
PROCESS Schottky Rectifier CPD38X 8 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalizatio.
centralsemi
CPZ40X - 5 Volt TVS
PROCESS 5 Volt TVS Chip CPZ40X Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization B.
centralsemi
CPZ39R - 5 Volt Quad TVS
PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Meta.
centralsemi
CPZ36R - 5.0 Volt TVS
PROCESS 5.0 Volt TVS Chip CPZ36R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization.
centralsemi
CPZ35R - 3.3 Volt TVS
PROCESS 3.3 Volt TVS Chip CPZ35R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization.
centralsemi
CPZ34R - 6.2 Volt TVS
PROCESS 6.2 Volt TVS Chip CPZ34R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization B.
centralsemi
CPZ33R - 12 Volt Quad TVS
PROCESS CPZ33R Transient Voltage Suppressor 12 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Met.
centralsemi
CPZ28 - 0.5 Watt Zener Diode
PROCESS Zener Diode CPZ28 0.5 Watt Zener Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Bac.
centralsemi
CPQ166 - TRIAC
PROCESS CPQ166 TRIAC 25 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side M.
centralsemi
CPD94X - 0.5 Amp Schottky Diode
PROCESS CPD94X Schottky Diode 0.5 Amp Schottky Diode Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back .
centralsemi
CPD93V - High Current Switching Diode
PROCESS CPD93V Switching Diode High Current Switching Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Met.
centralsemi
CPD92X - High Voltage Schottky Diode
PROCESS CPD92X Schottky Diode High Voltage Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metal.
centralsemi
CPD89V - High Current Diode
PROCESS CPD89V Switching Diode High Current Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization .
centralsemi
CPD87R - Low Leakage Schottky Diode
PROCESS CPD87R Schottky Diode Low Leakage Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metali.
centralsemi
CPD85V - 1 Amp Schottky Barrier Rectifier
PROCESS Schottky Rectifier CPD85V 1 Amp Schottky Barrier Rectifier Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top .
centralsemi
CPD76X - 1 Amp Schottky Diode
PROCESS CPD76X Schottky Diode 1 Amp Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization.
centralsemi
CPD69 - 1 Amp Glass Passivated Rectifier
PROCESS General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip CPD69 PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area.
centralsemi
CPD34X - 10A / 60V Schottky Rectifier Die
Product Brief CPD31X CPD34X 10A, 60V Schottky Rectifier Die Die Size Die Thickness Die Passivation Anode Bonding Pad Area Top Side Metalization (CPD31X.