centralsemi Datasheet | Specifications & PDF Download

PROCESS Small Signal Transistor CP788X PNP - Low Noise Amplifier Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad A

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PROCESS 5 Volt TVS Chip CPZ40X Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization B

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PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Meta

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PROCESS 12 Volt TVS Chip CPZ37R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Ba

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PROCESS 5.0 Volt TVS Chip CPZ36R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization

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PROCESS 3.3 Volt TVS Chip CPZ35R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization

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PROCESS 6.2 Volt TVS Chip CPZ34R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization B

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PROCESS CPZ33R Transient Voltage Suppressor 12 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Met

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PROCESS Zener Diode CPZ28 0.5 Watt Zener Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Bac

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PROCESS CPQ166 TRIAC 25 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side M

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PROCESS CPD94X Schottky Diode 0.5 Amp Schottky Diode Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back

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PROCESS CPD93V Switching Diode High Current Switching Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Met

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PROCESS CPD92X Schottky Diode High Voltage Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metal

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PROCESS CPD89V Switching Diode High Current Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization

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PROCESS CPD87R Schottky Diode Low Leakage Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metali

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PROCESS Schottky Rectifier CPD85V 1 Amp Schottky Barrier Rectifier Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top

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PROCESS Schottky Rectifier CPD79 2 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization

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PROCESS CPD76X Schottky Diode 1 Amp Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization

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PROCESS General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip CPD69 PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area

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PROCESS Schottky Rectifier CPD38X 8 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalizatio

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