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CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK h

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CX32L003 ARM® Cortex®-M0+ 32-bit Microcontroller Datasheet CX32L003 ARM® Cortex®-M0+ 32-bit MCU, up to 64 KB Flash, 4 KB SRAM, 2.5-5.5V, TSSOP-20/Q

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CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK h

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CI-MCP Specification 4GB eNAND (x8) + 4Gb LPDDR2-S4B (x32) This document is a general product description and is subject to change without notice. SK

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Global LCD Panel Exchange Center www.panelook.com DESCRIPTION The following specifications are applied to the following IPS-Pro-TFT LCD module. Pro

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TZe-cPhonwiecraLl EDDaXta10S4h9e0et Specification AX32X0 SSC Drawn Approval 고객명 Approval Rev. 07 September 2010 1 www.ACRICHE.com 서식번호 : SSC-QP-

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K4M563233D-M(E)E/N/I/P CMOS SDRAM 8Mx32 Mobile SDRAM 90FBGA (VDD/VDDQ 3.0V/3.0V or 3.3V/3.3V) Revision 1.1 December 2002 Rev. 1.1 Dec. 2002 K4M56

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Diagonal 6.46 mm (Type 1/2.8) CMOS Solid-state Image Sensor with Square Pixel for Color Cameras Tentative IMX327LQR-C Description The IMX327LQR-C

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UMW MAX3232ESE 1.Description The UMW MAX3232ESE has two receivers and two drivers, and a dual charge-pump circuit. The device meets the requirements

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MAX3224–MAX3227/ AVAILABLE MAX3244/MAX3245 1µA Supply Current, 1Mbps, 3.0V to 5.5V, RS-232 Transceivers with AutoShutdown Plus ________________Gen

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19-1473; Rev 0; 4/99 ±15kV ESD-Protected, 1µA, 250kbps, 3.3V/5V, Dual RS-232 Transceivers with Internal Capacitors ________________General Descriptio

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W25X16, W25X16A, W25X32, W25X64 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI Publication Release Date: May 5

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www.DataSheet4U.net 256Mbit MOBILE DDR SDRAM based on 2M x 4Bank x32 I/O Specification of 256Mb (8Mx32bit) Mobile DDR SDRAM Memory Cell Array - Org

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W25X16, W25X16A, W25X32, W25X64 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI Publication Release Date: May

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¡¾SHENZYAGXITCOL.,D¿ w.yxctalom YSX321SL X322516MRB4SI Y X 16 C . 0 X X X Features gExternal dimensions: 3.2 x 2.5 x 0.8 mm. gFrequency ran

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M25PX32 Serial Flash Embedded Memory Features M25PX32 NOR Serial Flash Embedded Memory 32Mb, Dual I/O, 4KB Subsector Erase, 3V Serial Flash Memory wit

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SDRAM 64Mb H-die (x32) CMOS SDRAM 64Mb H-die (x32) SDRAM Specification Revision 1.3 February 2004 *Samsung Electronics reserves the right to change

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Vacuum Fluorescent Display Module 512x32dots Type 39xx series “General Function” Software Specification Model: GU512X32H-39xx series Specification No

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Click here for production status of specific part numbers. MAX3221/MAX3223/ MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown General Descr

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K7A203600B K7A203200B K7A201800B Document Title Preliminary 64Kx36/x32 & 128Kx18 Synchronous SRAM 64Kx36 & 64Kx32 & 128Kx18-Bit Synchronous Pipeline

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