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Fairchild Semiconductor Electronic Components Datasheet

SFR9214 Datasheet

Advanced Power MOSFET

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Advanced Power MOSFET
SFR/U9214
FEATURES
ν Avalanche Rugged Technology
ν Rugged Gate Oxide Technology
ν Lower Input Capacitance
ν Improved Gate Charge
ν Extended Safe Operating Area
ν Lower Leakage Current : 10 µA (Max.) @ VDS = -250V
ν Lower RDS(ON) : 3.15 (Typ.)
BVDSS = -250 V
RDS(on) = 4.0
ID = -1.53 A
D-PAK I-PAK
2
11
2
33
Absolute Maximum Ratings
Symbol
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
PD
TJ , TSTG
TL
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TC=25oC)
Continuous Drain Current (TC=100oC)
Drain Current-Pulsed
O1
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
O2
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (TA=25oC) *
Total Power Dissipation (TC=25oC)
Linear Derating Factor
O1
O1
O3
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8from case for 5-seconds
1. Gate 2. Drain 3. Source
Value
-250
-1.53
-0.97
-6.1
+_ 30
110
-1.53
1.9
-4.8
2.5
19
0.15
- 55 to +150
300
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W
W/oC
oC
Thermal Resistance
Symbol
Characteristic
Typ.
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient *
Junction-to-Ambient
--
--
--
* When mounted on the minimum pad size recommended (PCB Mount).
Max.
6.58
50
110
Units
oC/W
Rev. B1
2001 Fairchild Semiconductor Corporation


Fairchild Semiconductor Electronic Components Datasheet

SFR9214 Datasheet

Advanced Power MOSFET

No Preview Available !

SFR/U9214
P-CHANNEL
POWER MOSFET
Electrical Characteristics (TC=25oC unless otherwise specified)
Symbol
BVDSS
BV/TJ
VGS(th)
IGSS
IDSS
RDS(on)
gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
Characteristic
Min. Typ. Max. Units
Test Condition
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coeff.
Gate Threshold Voltage
Gate-Source Leakage , Forward
Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source
On-State Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain( “Miller “) Charge
-250 -- --
-- -0.21 --
-2.0 -- -4.0
-- -- -100
-- -- 100
-- -- -10
-- -- -100
-- -- 4.0
-- 1.0 --
-- 225 295
-- 35 55
-- 13 20
-- 10 30
-- 18 45
-- 24 60
-- 11 30
-- 9 11
-- 2.0 --
-- 4.6 --
V
V/oC
V
nA
µA
S
pF
ns
nC
VGS=0V,ID=-250µA
ID=-250µA See Fig 7
VDS=-5V,ID=-250µA
VGS=-30V
VGS=30V
VDS=-250V
VDS=-200V,TC=125oC
VGS=-10V,ID=-0.77A
VDS=-40V,ID=-0.77A
O4
O4
VGS=0V,VDS=-25V,f =1MHz
See Fig 5
VDD=-125V,ID=-1.6A,
RG=24
See Fig 13
O4 O5
VDS=-200V,VGS=-10V,
ID=-1.6A
See Fig 6 & Fig 12 O4 O5
Source-Drain Diode Ratings and Characteristics
Symbol
IS
ISM
VSD
trr
Qrr
Characteristic
Continuous Source Current
Pulsed-Source Current
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Min. Typ. Max. Units
Test Condition
--
O1 --
-- -1.53
Integral reverse pn-diode
A
-- -6.1
in the MOSFET
O4 -- -- -4.0 V TJ=25oC,IS=-1.53A,VGS=0V
-- 130 -- ns TJ=25oC,IF=-1.6A
-- 0.61 -- µC diF/dt=100A/µs
O4
Notes ;
O1 Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
O2 L=75mH, IAS=-1.53A, VDD=-50V, RG=27*, Starting TJ =25oC
O3 ISD <_-1.6A, di/dt <_250A/µs, VDD <_BVDSS , Starting TJ =25oC
O4 Pulse Test : Pulse Width = 250µs, Duty Cycle <_ 2%
O5 Essentially Independent of Operating Temperature


Part Number SFR9214
Description Advanced Power MOSFET
Maker Fairchild Semiconductor
Total Page 7 Pages
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