(sec) 0.000678 0.240237 2.0167 58 0.1 τ1 τ2 τ3 τ4 Ci= τi/Ri Ci i/Ri 0.01 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zt.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6617 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package .

IRF6610

IRF6611

IRF6611PbF

IRF6611TRPbF

IRF6612

IRF6612PbF

IRF6612TR1

IRF6613

IRF6613PBF

IRF6613TRPBF

IRF6614

IRF6614PBF

IRF6614TRPBF