701 τi (sec) 0.00086 0.57756 8.94 106 0.01 0.001 SINGLE PULSE ( THERMAL RESPONSE ) Ci= τi/Ri Ci i/Ri Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc .

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6618 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package i.

IRF6610

IRF6611

IRF6611PbF

IRF6611TRPbF

IRF6612

IRF6612PbF

IRF6612TR1

IRF6613

IRF6613PBF

IRF6613TRPBF

IRF6614

IRF6614PBF

IRF6614TRPBF