Description
The IRF6645 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile.
Features
- 1000.0
VDS , Drain-toSource Voltage (V)
Fig 10. Typical Source-Drain Diode Forward Voltage
6.0
Fig11. Maximum Safe Operating Area
6.0
5.0
VGS(th) Gate threshold Voltage (V)
5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0
ID , Drain Current (A)
4.0
3.0
ID = 1.0A ID = 1.0mA ID = 250µA ID = 50µA
2.0
1.0
0.0 25 50 75 100 125 150
-75
-50
-25
0
25
50
75
100
125
150
TJ , Ambient Temperature (°C)
TJ , Temperature ( °C )
Fig 12. Maximum Drain Current vs. Ambient Temperature
120
Fig 13. Typic.