al Output Characteristics 1000 VDS = 15V ≤60µs PULSE WIDTH 100 T J = 150°C T J = 25°C T J = -40°C Typical RDS(on) (Normalized) Fig 5. Typical Output Characteristics 2.0 .

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6725MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET pack.

IRF6725MPBF

IRF6720S2TR1PBF

IRF6720S2TRPBF

IRF6721SPBF

IRF6721STRPBF

IRF6722MPBF

IRF6722MTRPBF

IRF6722SPBF

IRF6722STRPBF

IRF6723M2DTR1PBF

IRF6723M2DTRPBF

IRF6724MPBF

IRF6724MTRPBF