AWT6270 - Linear Power Amplifier Module
The AWT6270 meets the increasing demands for higher output power in UMTS handsets.
The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset.
The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability
AWT6270 Features
* InGaP HBT Technology High Efficiency: 44% @ POUT = +27 dBm 21% @ POUT = +16 dBm 15% @ POUT = +7 dBm
* Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode:
