AWT6274 - Linear Power Amplifier Module
The AWT6274 meets the increasing demands for higher output power in UMTS handsets.
The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset.
The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability
AWT6274 Features
* InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm
* Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode:
