GP200MLS12 - IGBT Chopper Module Preliminary Information

Datasheet Summary

Features

s s s s Internally Configured With Lower Arm Controlled Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction KEY.

Dynex Semiconductor

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Datasheet Details

Part number	GP200MLS12
Manufacturer	Dynex Semiconductor
File Size	127.12 KB
Description	IGBT Chopper Module Preliminary Information
Datasheet	GP200MLS12 Datasheet
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GP200MLS12 GP200MLS12 IGBT Chopper Module Preliminary Information DS5421-1.5 April 2001 FEATURES s s s s Internally Configured With Lower Arm Controlled Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1200V 2.7V 200A 400A APPLICATIONS s s s s s High Power Choppers Motor Controllers Induction Heating Resonant Converters Power Supplies 11(C2) 1(A1C2) 2(E2) 6(G2) 7(E2) 3(K1) The Powerline range of high power modules includes half bridge, dual and single switch configurations covering voltages from 600V to 3300V and currents up to 2400A.

Published: Mar 23, 2005 |