Part number:
LP7512
Manufacturer:
Filtronic Compound Semiconductors
File Size:
36.64 KB
Description:
Ultra low noise phemt.
* 0.6 dB Noise Figure at 12 GHz
* 12 dB Associated Gain at 12 GHz
* Low DC Power Consumption
* Excellent Phase Noise DRAIN BOND PAD (2X) GATE BOND PAD (2X) LP7512 SOURCE BOND PAD (2x) DIE SIZE: 18.0X13.0 mils (460x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PA
LP7512
Filtronic Compound Semiconductors
36.64 KB
Ultra low noise phemt.
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