DSEP30-06CR Datasheet - IXYS Corporation

DSEP30-06CR, Epitaxial Diode

DSEP 30-06CR HiPerDynFREDTM Epitaxial Diode with soft recovery (Electrically Isolated Back Surface) Preliminary Data VRSM V 600 VRRM V 600 DSEP 30-06.

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DSEP30-06CR_IXYSCorporation.pdf

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Datasheet Details

Part number:

DSEP30-06CR

Manufacturer:

IXYS Corporation

File Size:

21.92 KB

Description:

Epitaxial Diode

Features

* q TC = 25°C 50/60 Hz RMS; IISOL £ 1 mA mounting force with clip typical 250 2500 20120 6 q q q q q Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Low cathode to tab capacitance (

Applications

* q Symbol IR x Conditions TVJ = 25°C VR = VRRM TVJ = 150°C VR = VRRM IF = 30 A; TVJ = 150°C TVJ = 25°C Characteristic Values typ. max. 250 1 1.79 2.46 0.6 0.25 20 4.5 7.0 µA mA V V K/W K/W ns A q q q VF y RthJC RthCH trr IRM q q q q with heatsink compound IF = 1 A; -di/dt = 200 A/µs; VR = 30

DSEP30-06CR Distributors

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DSEP30-06CR Epitaxial Diode IXYS Corporation

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