Datasheet Specifications
- Part number
- DSEP30-06CR
- Manufacturer
- IXYS Corporation
- File Size
- 21.92 KB
- Datasheet
- DSEP30-06CR_IXYSCorporation.pdf
- Description
- Epitaxial Diode
Description
DSEP 30-06CR HiPerDynFREDTM Epitaxial Diode with soft recovery (Electrically Isolated Back Surface) Preliminary Data VRSM V 600 VRRM V 600 DSEP 30-06.Features
* q TC = 25°C 50/60 Hz RMS; IISOL £ 1 mA mounting force with clip typical 250 2500 20120 6 q q q q q Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Low cathode to tab capacitance (Applications
* q Symbol IR x Conditions TVJ = 25°C VR = VRRM TVJ = 150°C VR = VRRM IF = 30 A; TVJ = 150°C TVJ = 25°C Characteristic Values typ. max. 250 1 1.79 2.46 0.6 0.25 20 4.5 7.0 µA mA V V K/W K/W ns A q q q VF y RthJC RthCH trr IRM q q q q with heatsink compound IF = 1 A; -di/dt = 200 A/µs; VR = 30DSEP30-06CR Distributors
📁 Related Datasheet
📌 All Tags