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IRF6100 - HEXFET Power MOSFET

IRF6100 Description

l Ultra Low RDS(on) per Footprint Area l Low Thermal Resistance l P-Channel MOSFET l One-third Footprint of SOT-23 l Super Low Profile (<.8mm) l Avail.
True chip-scale packaging is available from International Rectifier.

IRF6100 Applications

* These benefits, combined with the ruggedized device design , that International Rectifier is well known for, provides the designer with an extremely efficient and reliable device. G The FlipFET™ package, is one-third the footprint of a comparable SOT-23 package and has a profile of less than .8mm

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HEXFET Power MOSFET International Rectifier
International Rectifier IRF6100-like datasheet