* Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows
MTD6N15
Motorola
180.43 KB
Power mosfet.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
www.DataSheet4U.com
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Power Field Effect Transistor DPAK for Surf.
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