BCW30LT1 Datasheet, Silicon), ON Semiconductor

BCW30LT1 Features

• Silicon) or maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from

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BCW30LT1

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ON Semiconductor ↗

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📄 Datasheet

Description:

General purpose transistors(pnp silicon).

BCW30LT1 Application

• Applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct

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BCW30LT1

ON Semiconductor

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