N0014EU Datasheet

Features and Benefits

• Low Input Capacitance: 2.3pF Typical
• Low Gate Leakage: 1.5pA Typical
• High Breakdown Voltage: -30V Typical
• High Input Impedance
• Die Size: 482um X 482um X 203um
• Bond Pads: 90um Diameter
• Substrate Connected to Gate
• Au Back Side Finish
• Flip Chip Bumped Package Option Applications
• Sma.