• Low Noise: 2.0 nV/√Hz Typical
• Typical Input Capacitance: 7.0pF
• Typical Breakdown Voltage: -30V
• Small Die: 467um X 467um X 203um
• Bond Pads: 90um X 90um
• Substrate Connected to Gate
• Au Back-Side Finish
Applications
• Low Noise Amplifier
• Audio Amplifiers
• Matched Pair Applications
• Cus.