• Low Input Capacitance: 5.0pF Typical
• Low Gate Leakage: 10pA Typical
• High Breakdown Voltage: -30V Typical
• High Input Impedance
• Small Die: 365um X 365um X 203um
• Bond Pads: 90um X 90um
• Substrate Connected to Gate
• Au Back-Side Finish
Applications
• Low-Noise, High Gain Amplifier
• Small .