Part number:
LP6836
Manufacturer:
Filtronic Compound Semiconductors
File Size:
35.54 KB
Description:
Medium power phemt.
* 25 dBm Output Power at 1-dB Compression at 18 GHz
* 9.5 dB Power Gain at 18 GHz
* 55% Power-Added Efficiency DRAIN BOND PAD SOURCE BOND PAD (2x) LP6836 GATE BOND PAD
* DESCRIPTION AND APPLICATIONS DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THICKNESS: 3.9 mils (1
LP6836
Filtronic Compound Semiconductors
35.54 KB
Medium power phemt.
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