Part number:
LP6872
Manufacturer:
Filtronic Compound Semiconductors
File Size:
38.59 KB
Description:
0.5w power phemt.
* 27 dBm Output Power at 1-dB Compression at 18 GHz
* 9.5 dB Power Gain at 18 GHz
* 55% Power-Added Efficiency DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) LP6872 GATE BOND PAD (2X)
* DESCRIPTION AND APPLICATIONS DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3
LP6872
Filtronic Compound Semiconductors
38.59 KB
0.5w power phemt.
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