Datasheet Details
- Part number
- LP6872
- Manufacturer
- Filtronic Compound Semiconductors
- File Size
- 38.59 KB
- Datasheet
- LP6872_FiltronicCompoundSemiconductors.pdf
- Description
- 0.5W POWER PHEMT
LP6872 Description
0.5W POWER PHEMT * .
AND APPLICATIONS
DIE SIZE: 14.
LP6872 Features
* 27 dBm Output Power at 1-dB Compression at 18 GHz
* 9.5 dB Power Gain at 18 GHz
* 55% Power-Added Efficiency
DRAIN BOND PAD (2X) SOURCE BOND PAD (2x)
LP6872
GATE BOND PAD (2X)
LP6872 Applications
* DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3.0 mils (75 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm)
The LP6872 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam directwrite 0.25 µ m
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