LP6872 Datasheet, Phemt, Filtronic Compound Semiconductors

LP6872 Features

• Phemt
• 27 dBm Output Power at 1-dB Compression at 18 GHz
• 9.5 dB Power Gain at 18 GHz
• 55% Power-Added Efficiency DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) LP6872

PDF File Details

Part number:

LP6872

Manufacturer:

Filtronic Compound Semiconductors

File Size:

38.59kb

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📄 Datasheet

Description:

0.5w power phemt. AND APPLICATIONS DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3.0 mils (75 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm) The LP

LP6872 Application

• Applications DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3.0 mils (75 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm) The LP6872 is an Aluminum

TAGS

LP6872

Filtronic Compound Semiconductors

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