IXFL60N60 Datasheet (IXYS Corporation)

IXFL60N60, MOSFET

HiPerFETTM Power MOSFETs ISOPLUS264TM IXFL 60N60 (Electrically Isolated Backside) Single Die MOSFET VDSS ID25 RDS(on) = 600 V = 60 A = 80 mΩ Preliminary Data Sheet Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD FC TJ TJM Tstg VISOL Md Weight Symbol VDSS VGH(th) IGSS IDSS RDS(on) Test Conditions TJ= 25°C to 150°C TJ= 25°C to 150°C; RGS = 1 MΩ Continuous Transient TC= 25°C, Chip capability TC= 25°C, pulse width limited by TJM TC= 25°C TC= 25°C TC= 25°C IS ≤ IDM, di/dt ≤ 100 A/µs,

IXFL60N60 Features

* z Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation z Low drain to tab capacitance(