* Silicon Chip on Direct-Copper Bond (DCB) Substrate
* Isolated Mounting Surface
* 2500V~ Electrical Isolation
* LAovwalaQnGche Rated
* Low Package Inductance Symbol Test Conditions (TJ = 25C Unless Otherwise Specified) BVDSS VGS = 0V, ID = 1mA VGS(th) VDS =
IXTR102N65X2 Datasheet (146.91 KB)
IXTR102N65X2
IXYS
146.91 KB
Power mosfet.
X2-Class Power MOSFET (Electrically Isolated Tab) Advance Technical Information IXTR102N65X2 VDSS = ID25 = RDS(on) 650V 54A 33m N-Channel Enha.
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