* Silicon Chip on Direct-Copper Bond (DCB) Substrate
* Isolated Mounting Surface
* 2500V~ Electrical Isolation
* LAovwalaQnGche Rated
* Low Package Inductance Symbol Test Conditions (TJ = 25C Unless Otherwise Specified) BVDSS VGS = 0V, ID = 1mA VGS(th) VDS =
IXTR102N65X2 Datasheet (146.91 KB)
IXTR102N65X2
IXYS
146.91 KB
Power mosfet.
X2-Class Power MOSFET
(Electrically Isolated Tab)
Advance Technical Information
IXTR102N65X2
VDSS = ID25 =
RDS(on)
650V 54A 33m
N-Channel Enha.
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