z Silicon Chip on Direct-Copper Bond (DCB) Substrate
z miniBLOC, with Aluminium Nitride Isolation
z Optimized for Low Switching Losses z Isolated Mounting Surface z Anti-
✔ IXXN200N60C3H1 Application
z Power Inverters z UPS z Motor Drives z SMPS z PFC Circuits z Battery Chargers z Welding Machines z Lamp Ba
