Description
PD - 97086 IRF6635PbF IRF6635TRPbF www.DataSheet4U.com l l l l l l l l l RoHs Compliant Lead-Free (Qualified up to 260°C Reflow) Application Speci.
The IRF6635PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resi.
Features
* rward Voltage
200
VGS(th) Gate threshold Voltage (V)
Fig11. Maximum Safe Operating Area
2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 ID = 250µA
175 150 125 100 75 50 25 0 25 50 75 100 125 150 T C , Case Temperature (°C)
ID, Drain Current (A)
-75 -50 -25
0
25
50
75 100 125 150
T J , Temperature ( °C
Applications
* PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best therma