Description
RoHs Compliant Lead-Free (Qualified up to 260°C Reflow) l Application Specific MOSFETs l Ideal for CPU Core DC-DC Converters l Low Conduction Losses.
The IRF6678PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resi.
Features
* 40
ID, Drain Current (A)
Limited By Package
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 ID = 250µA
120 100 80 60 40 20 0 25 50 75 100 125 150 T C , Case Temperature (°C)
-75 -50 -25
0
25
50
75 100 125 150
T J , Temperature ( °C )
Fig 12. Maximum Drain Current vs. Case Temperature
900
EAS , Single Puls
Applications
* PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best therma