74F11 Datasheet | Specifications & PDF Download

74F11 Triple 3-Input AND Gate April 1988 Revised September 2000 74F11 Triple 3-Input AND Gate General Description This device contains three indepen

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SN74F112 DUAL NEGATIVE-EDGE-TRIGGERED J-K FLIP-FLOP WITH CLEAR AND PRESET SDFS048A – D2932, MARCH 1987 – REVISED OCTOBER 1993 • Package Options Inclu

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INTEGRATED CIRCUITS 74F10 Triple 3-input NAND gate 74F11 Triple 3-input AND gate Product specification IC15 Data Handbook 1989 Sep 20 Philips Semico

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INTEGRATED CIRCUITS 74F113 Dual J-K negative edge-triggered flip-flops without reset Product specification IC15 Data Handbook 1991 Feb 14 Philips Se

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74F113 Dual JK Negative Edge-Triggered Flip-Flop April 1988 Revised July 1999 74F113 Dual JK Negative Edge-Triggered Flip-Flop General Description T

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MC54/74F11 TRIPLE 3-INPUT AND GATE TRIPLE 3-INPUT AND GATE FAST™ SCHOTTKY TTL VCC 14 13 12 11 10 9 8 J SUFFIX CERAMIC CASE 632-08 14 1 1 2 3 4

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MC74F112 DUAL JK NEGATIVE EDGE-TRIGGERED FLIP-FLOP The MC74F112 contains two independent, high-speed JK flip-flops with Direct Set and Clear inputs. S

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SN74F112 DUAL NEGATIVE-EDGE-TRIGGERED J-K FLIP-FLOP WITH CLEAR AND PRESET SDFS048A – D2932, MARCH 1987 – REVISED OCTOBER 1993 • Package Options Inclu

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INTEGRATED CIRCUITS 74F112 Dual J-K negative edge-triggered flip-flop Product specification IC15 Data Handbook 1990 Feb 09 Philips Semiconductors P

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74F11 Triple 3-Input AND Gate 74F11 Triple 3-Input AND Gate General Description This device contains three independent gates, each of which performs

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74F112 Dual JK Negative Edge-Triggered Flip-Flop April 1988 Revised July 1999 74F112 Dual JK Negative Edge-Triggered Flip-Flop General Description T

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74F114 Dual JK Negative Edge-Triggered Flip-Flop April 1988 Revised August 1999 74F114 Dual JK Negative Edge-Triggered Flip-Flop with Common Clocks

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• Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs description These devic

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• Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs description These devic

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