Description
SIDC161D170H Fast switching diode chip in EMCON 3 -Technology .
AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prü.
Features
* A
* 1700V EMCON 3 technology 200 µm chip This chip is used for:
* soft, fast switching
* EUPEC power modules
* low reverse recovery charge
Applications
* C
* resonant applications, drives
Chip Type SIDC161D170H
VR
IF
Die Size
1700V 300A 12.7 x 12.7 mm2
Package Ordering Code
sawn on foil
Q67050-A4180A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per w