Description
PD - 96229 HEXFET® Power MOSFET plus Schottky Diode RoHs Compliant and Halogen-Free VDSS VGS RDS(on) RDS(on) l Integrated Monolithic Schottky Dio.
Features
* ent (A) 100 100 10msec 10 DC 1 100µsec 1msec 10 T J = 150°C 1 T J = 25°C T J = -40°C VGS = 0V 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VSD, Source-to-Drain Voltage (V) TA = 25°C TJ = 150°C Single Pulse 0.1 0.01 0.10 1.00 10.00 100.00 VDS, Drain-to-Source Voltage (V) Fig 10. Typical SourcApplications
* PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermaIRF6729MTRPBF Distributors
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