K9F1G08R0A Datasheet - Samsung semiconductor

K9F1G08R0A 128M x 8 Bit / 256M x 8 Bit NAND Flash Memory

of Copy-back program is changed 4. Voltage range is changed -1.7V~1.95V -> 1.65V~1.95V 5. Note2 of Command Sets is added 1. CE access time : 23ns->35ns (p.11) 1. The value of tREA for 3.3V device is changed.(18ns->20ns) 2. EDO mode is added. 1. The flow chart to creat the initial invalid block table.

K9F1G08R0A K9F1G08U0A K9K2G08U1A FLASH MEMORY Document Title 128M x 8 Bit / 256M x 8 Bit NAND Flash Memory Revision History Revision No 0.0 0.1 History 1. Initial issue 1. The tADL(Address to Data Loading Time) is added. - tADL Minimum 100ns (Page 11, 23~26) - tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle at program operation. 2. Added Addressing method for program operation Draft Date Aug. 24. 2003 Jan. 27. 2004 Remark Advance Pr.

K9F1G08R0A Features

* Voltage Supply -1.8V device(K9F1G08R0A): 1.65V~1.95V -3.3V device(K9F1G08U0A): 2.7 V ~3.6 V

* Organization - Memory Cell Array : (128M + 4,096K)bit x 8bit - Data Register : (2K + 64)bit x8bit - Cache Register : (2K + 64)bit x8bit

* Automatic Program and Erase - Page Program

K9F1G08R0A_Samsungsemiconductor.pdf