• Part: HVC135
  • Description: Silicon Epitaxial Trench Pin Diode
  • Category: Diode
  • Manufacturer: Kexin Semiconductor
  • Size: 28.54 KB
Download HVC135 Datasheet PDF
Kexin Semiconductor
HVC135
Features Adopting the trench structure improves low capacitance.(C=0.6p F max) Low forward resistance. (rf=2.0 max) Low operation current. +0.05 0.8 -0.05 SOD-523 1.2+0.1 -0.1 + +0.05 0.3 -0.05 Unit: mm 0.6+0.1 -0.1 - 1.6+0.1 -0.1 0.77max +0.05 0.1 -0.02 0.07max A bsolute M axim um R atings T a = 25 Param eter P eak reverse voltage R everse voltage Forward current P ower dissipation Junction tem perature Storage tem perature Sym bol VRM VR IF Pd Tj T stg V alue 65 60 100 150 125 -55 to +125 U nit V V m A m W Electrical Characteristics Ta = 25 P aram eter Reverse current Reverse voltage Capacitance Forward resistance ESD-Capability - 1 Symbol IR VF C rf Conditions VR = 60 V IF = 2 m A VR = 1 V, f = 1 MHz IF = 2 m A, f = 100 MHz C =200p F, Both forward and reverse direction 1 pulse Note 1. Failure criterion ; IR > 100 n A at VR = 60V. Min Typ Max Unit 0.6 p F Marking Marking P5 .kexin..cn...