IXGH39N60B HiPerFAST IGBT

IXYS Corporation

Description

HiPerFASTTM IGBT IXGH39N60B IXGH39N60BD1 IXGT39N60B IXGT39N60BD1 VCES IC25 VCE(sat) tfi = = = = 600 V 76 A 1.7 V 200 ns Preliminary data (D1) www.

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Datasheet Specifications

Part number: IXGH39N60B
Manufacturer: IXYS Corporation
File Size: 187.65 KB
Datasheet: IXGH39N60B_IXYSCorporation.pdf
Description: HiPerFAST IGBT

Features

* z Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3) TO-247 z 1.13/10Nm/lb. in. TO-247 AD TO-268 6 4 g g z z International standard packages JEDEC TO-247 AD & TO-268 High current handling capability Newest generation HDMOSTM process MOS Ga

Applications

* Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) Min. Typ. Max. 39N60B 39N60BD1 39N60B 39N60BD1 39N60B 39N60B 39N60BD1 600 600 2.5 2.5 5.0 5.0 200 1 3 ±100 1.7 V V V µA mA mA nA V z z z z z z BVCES VGE(th) ICES IC IC IC IC = 250 µA, VGE = 0 V = 750 µA = 250 µA,

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IXGH39N60B HiPerFAST IGBT IXYS Corporation

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